Detailed Product Description

Polypropylene film Metal foil Capacitor (PPN) OF feature:

PPN are constructed with polypropylene film dielectric. aluminum foil electrode,copperply lead and epoxy resin in non-ductive type.They are suitable for blocking, bypass coupling temperature compensation and ideal for
use in telecommunication equipments,data processing equipments,industrial instruments, automatic control system and other general electronic equipments.
SPECIFICATION
l.rence standards:
GB 10188-88(China)
IEC 384-1 (international)
IEC 384-13(international)
2.RATED VOLTAGE(Vr):
100VDC;250VDC
400VDC;630VDC

3.OPERATION TEMPERATURE RANGE:-50~+ 100

4.CAPACITANCE RANGE:0,001μF-0.47μF

5.CAPACITANCE TOLERANCE:
J(±5%), K( ±10% ),M(±20%)

6.DESSIPATION FACTOR TAN 5 :
(25±5)
DF: ≤0.1%(1KHz)

7.INSULATION RESISTANCE:
BETWEEN TERMINALS:
TEST CONDITIONS:
TEMPERATURE:25 ±5
VOLTAGE CHARGE TIME:IMIN.
VOLTAGE CHARGE: 100VDC
30000MΩ

8.WITHSTAND VOLTAGE:2Vr(2SEC)

9.HUMIDITY TEST CONDITIONS:
TEST TEMPERATURE:40±2
RELATIVE HUMIDITY:93±2%
TEST DURATION:21 DAYS
TEST CRITERIA:
CAPACITANCE DRIFT:≤±5% OF THE
INITIAL VALUE.
DISSIPATION CHANGE:≤±1% AT 1KHz
INSULATION RESISTANCE:≥50% OF
INITIAL LIMIT.

lO.LIFE.TEST CONDITIONS:
TEST TEMPE RATU RE:85±2
TEST VOLTAG E: 1.25Vr
TEST DURATION: 1,000HOURS
TEST CRITERIA:
CAPACITANCE CHANGE:≤1.5% OF THE
INITIAL LIMIT.
DISSIPATION FACTOR:
≤1.5 OF INCREASED VALUE
INSULATION RESIST ANCE: ≥50% OF
SPECIFIED VALUE

1 I.SOLDERABILITY CONDITIONS:
SOLDER BATH TEMPERATURE:235±5
SOLDER MATERIAL:60%TIN+40% OF LEAD
SOLDER TIME:2±0.5SEC
TEST CRITERIA:75% OF SURFACE TINNING

12.SOLDERING HEAT RESISTANCE:
SOLDER BATH TEMPERATU RE:260±5
SOLDER TIME:5±1SEC
TEST CRITERIA:
CAPACITANCE CHANGE:≤±2% OF
THE INITIAL VALUE