Metallized Polypropylene film Capacitor (MPR)
1 Low disspipation fact
2.High stability of capacitance and DF versus temperature and requenccy Non-inductive construciton and self-healing property.

FEATURES:
1 Low disspipation fact
2.High stability of capacitance and DF versus temperature and requenccy Non-inductive construciton and self-healing property.

GENERAL TECHNICAL DATA

L.S.(mm) 15 22.5 27.5 L(nH) 10 18 18

Insulation resistance:
Test conditions
Temperature:      +25^oC±5
Voltage charge time: 1 min
Voltage charge:     100Vdc
Performance
>20000mΩ(C≤F)
>2000mΩ*μ F(C>0.1μ F)
WITHSTAND VOLTAGE:     1.6Vr(2SEC)

TEST METHOD AND PERFORMANCE
Test conditions
Temperature:        +25±5^oC
Voltage charge time:  lmin
Voltage charge:      100VDC 10VDC

performance
>20000mΩ(C≤0.1μF)
>2000mΩ*μF(C>0.1μF)

WITHSTAND VOLTAGE:   1.6Vr(2SEC)
TEST METHOD AND PERFORMANCE
Test conditions
temperature:      +40^oC ±2^oC
Relative humidity(RH):93% ±2%
Test duration:      21 days

Performance
Capacitance change(~C/C): ≤±5%
DFchange(/~DF):          ≤5% at 1KHz
insulation resistance:       ≥50% of initial limit

Endurance:
Test conditions
                    temperature: 85^oC±2^oC
Test duration: 1000h
Voltage aplied:1.25xVr
Capacitance change(/~C/C): ≤±5%
DFchange(~DF):          ≤5% at 10KHz for C≤uF
Insulation resistance:       ≥50% of initial limit

Resistance to soldering heat:
Test conditions
Solder bath temperature:+260±5^oC
Dipping time(with heat screen):5s±1 s

Performance
Capacitance change(/~ C/C):≤±2%
DFchange(ADF):          ≤50dx10(-4) at 1KHz
Insulation resistance:       ≥50% of initial limit