Detailed Product Description

Polypropylene film Metal foil Capacitor Non-Inductive (PPN)

FEATURES:
Low disspipation factor and high insulation resistance.
High stability of capacitance and DF versus
temperature and frequency.
Low equivalent series resistance.
Non-inductive construction.

SPECIFICATION
l.rence standards:
GB 10188-88(China)
IEC 384-1 (international)
IEC 384-13(international)

2.RATED VOLTAGE(Vr):
100VDC;250VDC
400VDC;630VDC

3.OPERATION TEMPERATURE RANGE:-50~+ 100

4.CAPACITANCE RANGE:0,001μF-0.47μF

5.CAPACITANCE TOLERANCE:
J(±5%), K( ±10% ),M(±20%)

6.DESSIPATION FACTOR TAN 5 :
(25±5)
DF: ≤0.1%(1KHz)

7.INSULATION RESISTANCE:
BETWEEN TERMINALS:
TEST CONDITIONS:
TEMPERATURE:25 ±5
VOLTAGE CHARGE TIME:IMIN.
VOLTAGE CHARGE: 100VDC
30000MΩ

8.WITHSTAND VOLTAGE:2Vr(2SEC)

9.HUMIDITY TEST CONDITIONS:
TEST TEMPERATURE:40±2
RELATIVE HUMIDITY:93±2%
TEST DURATION:21 DAYS
TEST CRITERIA:
CAPACITANCE DRIFT:≤±5% OF THE
INITIAL VALUE.
DISSIPATION CHANGE:≤±1% AT 1KHz
INSULATION RESISTANCE:≥50% OF
INITIAL LIMIT.

lO.LIFE.TEST CONDITIONS:
TEST TEMPE RATU RE:85±2
TEST VOLTAG E: 1.25Vr
TEST DURATION: 1,000HOURS
TEST CRITERIA:
CAPACITANCE CHANGE:≤1.5% OF THE
INITIAL LIMIT.
DISSIPATION FACTOR:
≤1.5 OF INCREASED VALUE
INSULATION RESIST ANCE: ≥50% OF
SPECIFIED VALUE

1 I.SOLDERABILITY CONDITIONS:
SOLDER BATH TEMPERATURE:235±5
SOLDER MATERIAL:60%TIN+40% OF LEAD
SOLDER TIME:2±0.5SEC
TEST CRITERIA:75% OF SURFACE TINNING

12.SOLDERING HEAT RESISTANCE:
SOLDER BATH TEMPERATU RE:260±5
SOLDER TIME:5±1SEC
TEST CRITERIA:
CAPACITANCE CHANGE:≤±2% OF
THE INITIAL VALUE