MER are constructed with metalized polyester film dielectric,
copperply lead and epoxy resin coating.They are suitable for
blocking,coupling,decoupling filtering,bypass timing circuit,and
ideal for use in telecommunication equipments data processing
equipments,industrial instruments,automatic control system
and other general electronic equipments.

FEATURES:
1 .Low disspipation factor and high insulation resistance
2.High stability of capacitance and DF versustempersture and
frequency Non-inductive construcdion and self-healing property.
3.Flame retardant epoxy resin coating.

GENERAL TECHNICAL DATA
Dieelectric:Polyester film.
Plates:Aluminium layer deposited by evaporation under vacuum.
Winding:Non-inductive type.
Leads:Tinned wire.
Marking:Capacitance,tolerance,D.C.rated voltage
Operating temperature range:-40 to +80^oC

ELECTRECAL CHARACTERISTICS
Rated voltage(Vr):100Vdc~250Vdc~400Vdc-630Vdc
Capacitance values:E6 series(IEC 63 Norm).
Capacitance tolerances(measured at I kHz):±5%(J); ±10%(K); ~ 20%(M).
Dissipation factor(DF):At+25^oC±5^oC

WITHSTAND VOLTAGE:
1.6Vr(2SEC)
Insulation resisstance:
Test conditions:
Temperature: +25 i 5±5^oC
Voltage charge time: lmin
Voltage charge: 100Vdc
Performance:
≥3x 104 mΩ for C≤0.33μF
≥1x 104mΩ.μF for C≤0.33μF

TEST METHOD AND PERFORMANCE
Test conditions
Temperature: +40 ±2^oC
Relative humidity(RH): 93%±2^oC
Test duration: 21 days
performance
Capacitance change(C/C): ≤±5%
DF change(ADF): ±5% at 1 KHz
Insulation resistance: ≥50% of initial limit
Endurance:
Test conditions
temperature: +85^oC ±2^oC
Test duration: 1000h
Voltage applied: 1.25xVr
Capacitance change(C/C): ≤±5%
DF change(ADF): ~ 5% at 10KHz for C≤1uF
≤3% at 1KHz for C>1uF
Insulation resistance: ≥50% of initial limit
Resistance to soldering heat:
Test conditions
Solder bath temperature: +260±5^oC
Dipping time(with heat screen): 5s±1s
Performance
Capacitance change(C/C):≤ ±2% of the initial value.
Appearance:no damage and good tinning.