Detailed Product Description

Product Description

Metallized Polypropylene film Capacitor; High stability of capacitance and DF versus temperature and requenccy Non-inductive

Metallized Polypropylene film Capacitor feature:

MPR are constructed with metaiized polypropylene film dielectric, eopperply lead and epoxy resin coating. They are suitable for blocking, by-pass, coupling, deeoupling filtering, timing, tuning temperature compensation, and ideal for use in telecommunication equipments, data processing equipments,
Industrial instruments, automatic control system and other general electronic equipments.

FEATURES:
1 Low disspipation fact
2. High stability of capacitance and DF versus temperature and requenccy Non-inductive construciton and self-healing property.

GENERAL TECHNICAL DATA
L. S. (mm) 15 22.5 27.5
L(nH) 10 18 18

Insulation resistance:
Test conditions
Temperature: +25oC± 5
Voltage charge time: 1 min
Voltage charge: 100Vdc
Performance
>20000mΩ(C≤ F)
>2000mΩ*μ F(C>0.1μ F)
WITHSTAND VOLTAGE: 1.6Vr(2SEC)

TEST METHOD AND PERFORMANCE
Test conditions
Temperature: +25± 5oC
Voltage charge time: Lmin
Voltage charge: 100VDC 10VDC

Performance
>20000mΩ(C≤ 0.1μF)
>2000mΩ*μF(C>0.1μF)

WITHSTAND VOLTAGE: 1.6Vr(2SEC)
TEST METHOD AND PERFORMANCE
Test conditions
Temperature: +40oC ± 2oC
Relative humidity(RH): 93% ± 2%
Test duration: 21 days

Performance
Capacitance change(~C/C): ≤ ± 5%
DFchange(/~DF): ≤ 5% at 1KHz
Insulation resistance: ≥ 50% of initial limit

Endurance:
Test conditions
Temperature: 85oC± 2oC
Test duration: 1000h
Voltage aplied: 1.25xVr
Capacitance change(/~C/C): ≤ ± 5%
DFchange(~DF): ≤ 5% at 10KHz for C≤ UF
Insulation resistance: ≥ 50% of initial limit

Resistance to soldering heat:
Test conditions
Solder bath temperature: +260± 5oC
Dipping time(with heat screen): 5s± 1 s

Performance
Capacitance change(/~ C/C): ≤ ± 2%
DFchange(ADF): ≤ 50dx10(-4) at 1KHz
Insulation resistance: ≥ 50% of initial limit